2010 Introduced Sapphire Thickness Sorting Machine to LED wafer field.
2010 Introduced Sapphire Thickness Measuring Machine to LED wafer field.
2009 Moved to new plant at No. 9, Ming Chuan Road.
2009 Introduced Sapphire Laser Marking Machine to LED wafer field.
2009 Established New Power Team Technology Inc.
1999 Signed technical cooperation agreement with Korea Towa.
1999 Introduced COB Die Bonder & PI Tester to Semi-conductor field.
1999 Introduced High Speed T/F Automation Machine to Semi-conductor field.
1998 Introduced EBGA Auto Mold De-gate System to Semi-conductor field.
1998 Introduced BGA Singulation System to Semi-conductor field.
1997 Introduced BGA Handler to Semi-conductor field.
1997 Signed technical cooperation agreement with Japan Li-teon.
1996 Introduced Lead forming & Marking Inspection Machine to Semi-conductor field.
1991 Introduced Trim & Form Automation Machine to Semi-conductor field.
1988 Established new plant at Minshen Road, Dayuan, Taoyuan.
1987 Introduced Oil Hydraulic System to Semi-conductor field.
1982 Ki-Giant Enterprise established at Taipei city.