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LED Wafer Process Equipment/Machine
Sapphire Thickness Measuring Machine
Sapphire Wafer Laser Marking machine
Sapphire Thickness Sorting Machine
IC Trim/Form System
High-Speed Trim Machine
High-Speed T/F/S Machine
Oil Hydraulic System
125 Tons Molding Press
250 Tons Molding Press
300 Tons Molding Press
Injection Molding Machine
Hybrid Injection Molding Machine
Customize Automation
Blood Glucose Test Strips Fabricate & Test Machine
Potting Machine
LED Wafer Process Equipment/Machine
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Sapphire Thickness Measuring Machine
›› None-touched laser detector, Z axis auto adjust the distence of laser detector
›› Measurement for 4 process (Wax, Grinding, 1st step polishing, 2nd step polishing).
›› PC may link with CIM and up-load the measuring data to particular file folder in WEB harddisk.
›› Allow to proceed offline measurement.
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Sapphire Wafer Laser Marking machine
›› 4 Axial (X,Y,Z,θ) control.
›› CCD detect and auto adjust the shift of X,Y,θ
›› Top or bottom side marking.
›› The marking data can be summarize and filing.
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Sapphire Thickness Sorting Machine
›› Server moter control the location of cassette
›› 3 Axial (X,Y,Z) control
›› Used Laser detector, precision ±2um (untouched measurment).
›› The cassette numbering can be set up by reading bar code label of work sheet and summary the measuring data in file.
