LED Wafer Process Equipment/Machine
Sapphire Thickness Sorting Machine

Devices/Units Specification
Load 2”/4” Wafer cassette * 8 set
Unload 2”/4” Wafer cassette * 10 set
Turn table of load/unload cassette Server moter control the location of cassette
Transport robot 3 Axial (X,Y,Z) control
Wafer load/unload direction Load : Bottom to Top
Unload: Top to Bottom
Thickness measurement Used Laser detector, precision ±2um (untouched measurment).
Single point/Cross/米 measueing route for culculating TV5/TTV.
Security protection 1.UPS installed for encure machine operation in power off.
2.Air tank installed for ensure machine operation in air off.
Cycle time Single point : 12 Sec./wafer. Cross : 20 Sec/wafer.
Post measurment distribution The unload cassette can be re-set per measuring results.
Data collection The cassette numbering can be set up by reading bar code label of work sheet and summary the measuring data in file.