LED Wafer Process Equipment/Machine
◆Sapphire Wafer Laser Marking machine
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| Devices/Units |
Specification |
| Load/Unload tooling |
Wafer cassette 2 sets, 2"、4"、6" changeable |
| Wafer size |
2” 、4” 、6” |
| Transport robot |
4 Axial (X,Y,Z,θ) control. |
| Wafer load/unload direction |
Load : Bottom to Top |
| Unload: Top to Bottom |
| Marking alignment |
CCD detect and auto adjust the shift of X,Y,θ |
| Security protection |
1.UPS installed for ensure machine operation in power off. |
| 2.Air tank installed for ensure machine operation in air off. |
| Cycle time |
15 sec/wafer (This standard is per 2" wafer single side marking) |
| Marking option |
Top or bottom side marking. |
| Data collection |
The marking data can be summarize and filing. |
| Laser head |
Keyence ML-Z9550,30W, CO2 Laser |
| Facility required |
Power : 1θ 220V. Air compressor : 5 kg/cm2. |
| Machine dimension |
1850 W * 2400 H * 1600 D (mm) |
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